Services

Design Solutions
Printed Circuit Board Design:

Printed Circuit Design has been a vast necessity by many companies at ITNDS we specialize in quick turn, Probe cards, Final Test, Burn In, and custom RF boards.                                                    


By utilizing schematic capture correlation to printed circuit boards we insure the highest level of quality, and pride.


PCB Manufacturing Services: 

We provide up to 52 layer boards, tight pitch, Tin Nickel. Full body gold. 


Assembly Services:  

Surface Mount and Plated Through Hole assembly .


Full Turnkey Production Assemblies


Standard delivery for design is one week upon approval of placement. Standard Delivery for fabrication is 2 weeks from approval date.  


Expedites are welcome.

IMG6
IMG5

                           Capabilities

Design Solutions: 

We specialize in Probe cards, Final Test, High speed RF, Mixed signal. 


Using PADS Power PCB, Power Logic.


With a capacity of 10 to 12 designs a month.


Probe cards, Load boards and Interface Designs.           


J750, 971, 973, 994, Catalyst, Tiger, AGilent83K, 93K, V4100, 44, 54, Schlumberger ITS9000, Advantest 5592, 6671, and many more.


Burn-in

KES GEN1, GEN5. AehrMax3, Gen5, AehrMAX3,4, ATxATX-3, FOX2, 14


General:


High Speed RF, Mother boards, back planes, feed-thru cards, dims, simms and any custom board requirement.


We will also reverse engineer from a blank board, gerbers, and AutoCAD dxf.  To our standard software. Utilizing  intelligence in our software to provide schematic diagrams. 


Assembly Services: 

We specialize in Tight pitch, surface mount, BGA, MBGA

DESIGN TOOLS AND CAPABILITY

IMG4
Schematic 

Pads Logic 

Dx-Designer 

Altium




Industrial

Telecom

IC Testing




High speed, Multilayer Digital and analog





Load Boards, Probe cards 

(DIB) Dut interface Boards

Layout Tools 

Altium 

Mentor Pads


AREA OF EXPOSURE

Defense & Aerospace 

R&D 

Computer


Design

Library Creation/Verification


Design Capabilities

Delay Matching

Fine pitch BGA


Design TYPES

(PIB) Probe Interface boards

(BIB) Burn In Boards

Gerber Verification Tools 

CAM350




Automotive 

Medical 

ATE



Signal Integrity analysis




Impedance control




Socket adaptor boards

MB/DB and Back Planes

boards
ADVANTEST 

T6673SQ 

T6372(ND2) 

T2000 

T6673SQ 

T6673ZIF 



Credence 

ASL1000 

QUARTET 

ITS9000 

EXA3000 

CATALYST 

J750 

V9300 

TIGER 

D70EX 

V83000

quartet2
ADVANTEST 

5592 

T6671 

T6672 

T6682 

T6683 

TR288

CREDENCE 

DUO9 

ASL3000 



TERADYNE 

J750 

J953 

J971 

J973 

J994 

TIGER 



LTX 

FLEX 

FUSION 

FUSION HF 

LB LTX CX

MANUFACTURING TOOLS AND CAPABILITIES

PCB MANUFACTURING 

Layer count of up to 56 

Minimum trace with 0.0025” 

Drilling aspect Ratio 34:1 

Controlled Impedance +/- 5% 


MECHANICAL MFG 

Maximum build size of 7 x 10X4” 

Aluminum, STAINLESS STEEL. 

G10, FR4, PLEXYGLASS, ABS, TORLON 


ASSEMBLY

Surface mount SMT & Through Holes

BGA & Micro-BGA Capabilities

01005 Placement

Press Fit Connectors

Cable and Harness Assembly

Turnkey or Consignment Kits

backboard
sideboard